METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD

Provided is a metal sintered bonding body having an excellent heat cycle resistance and heat dissipation performance. The metal sintered bonding body according to the present invention bonds a substrate and a die. At least the center part and a corner part of a rectangular region in which the metal...

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Bibliographische Detailangaben
Hauptverfasser:	UESHIMA Minoru, TAKEMASA Tetsu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Provided is a metal sintered bonding body having an excellent heat cycle resistance and heat dissipation performance. The metal sintered bonding body according to the present invention bonds a substrate and a die. At least the center part and a corner part of a rectangular region in which the metal sintered body faces the die has a low porosity region having a porosity lower than the average porosity of the rectangular region. The low porosity region is located in a strip-shaped region in which the center line is a diagonal of the rectangular region.