LIGHT EMITTING DEVICE PACKAGE

According to an embodiment, a light emitting device package includes: a first package body including a flat lower surface, an upper surface parallel to the lower surface, and first and second opening parts provided through the upper surface and the lower surface; a second package body disposed on th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Ki Seok, LIM, Chang Man, SONG, June O
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	According to an embodiment, a light emitting device package includes: a first package body including a flat lower surface, an upper surface parallel to the lower surface, and first and second opening parts provided through the upper surface and the lower surface; a second package body disposed on the first package body, and including an opening provided through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and including a first bonding part and a second bonding part. According to an embodiment, the upper surface of the first package body is coupled with the lower surface of the second package body, the first bonding part is disposed on the first opening part, and the second bonding part is disposed on the second opening part.