IMAGE CAPTURING MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY THEREFOR, MOLDED PHOTOSENSITIVE ASSEMBLY SEMI-FINISHED PRODUCT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE

A molded photosensitive assembly of an image capturing module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of lead wires electrically connecting the photosensitive element to the circuit board,...

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Bibliographische Detailangaben

Hauptverfasser:	GUO, Nan, WANG, Mingzhu, MEI, Zhewen, CHEN, Zhenyu, ZHAO, Bojie, TANAKA, Takehiko, HUANG, Zhen, LUAN, Zhongyu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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