IMAGE CAPTURING MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY THEREFOR, MOLDED PHOTOSENSITIVE ASSEMBLY SEMI-FINISHED PRODUCT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE

A molded photosensitive assembly of an image capturing module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of lead wires electrically connecting the photosensitive element to the circuit board,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GUO, Nan, WANG, Mingzhu, MEI, Zhewen, CHEN, Zhenyu, ZHAO, Bojie, TANAKA, Takehiko, HUANG, Zhen, LUAN, Zhongyu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A molded photosensitive assembly of an image capturing module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of lead wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.