SOLDER ALLOY AND RESIN FLUX CORED SOLDER

Provided is a solder alloy that contains 0.01 mass% or more and 0.1 mass% or less of Fe, 0.005 mass% or more and less than 0.02 mass% of Co, 0.1 mass% or more and 4.5 mass% or less of Ag, 0.1 mass% or more and 0.8 mass% or less of Cu, and the balance being Sn.

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Bibliographische Detailangaben
Hauptverfasser:	YUKIKATA, Kazuhiro, FURUSAWA, Mitsuyasu, MORI, Kimiaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a solder alloy that contains 0.01 mass% or more and 0.1 mass% or less of Fe, 0.005 mass% or more and less than 0.02 mass% of Co, 0.1 mass% or more and 4.5 mass% or less of Ag, 0.1 mass% or more and 0.8 mass% or less of Cu, and the balance being Sn.