COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION

COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION

A component (B) is specified which comprises a functional structure (FS) on a carrier (TR) that is spanned by a thin-layer covering (DSA) resting on said carrier. A first wiring layer (VE1) is applied onto or in the thin-layer covering and comprises structured conductor traces that are connected wit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ROSEZIN, Dr. Roland, SCHAUFELE, Dr. Ansgar
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
RESONATORS
TRANSPORTING
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Beschreibung
Zusammenfassung:A component (B) is specified which comprises a functional structure (FS) on a carrier (TR) that is spanned by a thin-layer covering (DSA) resting on said carrier. A first wiring layer (VE1) is applied onto or in the thin-layer covering and comprises structured conductor traces that are connected with the functional structure.