LEAD-FREE SOLDER ALLOY, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC CONTROL DEVICE

The present invention aims at providing a lead-free solder alloy, an electronic circuit substrate and a control device which comprises a solder joint that is formed by using the lead-free solder alloy, which are capable of suppressing crack propagation in a solder joint even in a harsh environment i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ARAI Masaya, KATSUYAMA Tsukasa, NAKANO Takeshi, HORI Atsushi, MUNEKAWA Yurika
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention aims at providing a lead-free solder alloy, an electronic circuit substrate and a control device which comprises a solder joint that is formed by using the lead-free solder alloy, which are capable of suppressing crack propagation in a solder joint even in a harsh environment in which a temperature difference is significant and to which vibration is applied, and of suppressing crack propagation in the vicinity of an interface even when performing solder-joining by using an electronic component without Ni/Pd/Au plating or Ni/Au plating. Provided is a lead-free solder alloy comprising : 1% by weight or more and 4% by weight or less of Ag; 1% by weight or less of Cu; 3% by weight or more and 5% by weight or less of Sb; and 0.01% by weight or more and 0.25% by weight or less of Ni, the remainder being Sn.