STRESS RELEASE METHOD AND DEVICE FOR PACKAGING FILM OF FLEXIBLE PHOTOVOLTAIC MODULE

STRESS RELEASE METHOD AND DEVICE FOR PACKAGING FILM OF FLEXIBLE PHOTOVOLTAIC MODULE

The disclosure provides a stress release method and device for packaging film of flexible photovoltaic module. The method comprises: placing (S100) a film (500) to be cut on a loading platform (100); cutting (S200) the film (500) with an insert (300) such that an incision (510) inclined relative to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YUAN, Qiang, ZENG, Jing, SUN, Shiyang, XU, Guojun, LI, Tao, LIAN, Chongyan, LIU, Lin
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:The disclosure provides a stress release method and device for packaging film of flexible photovoltaic module. The method comprises: placing (S100) a film (500) to be cut on a loading platform (100); cutting (S200) the film (500) with an insert (300) such that an incision (510) inclined relative to an edge of the film (500) is formed on the film (500); and activating (S300) the feeding mechanism and driving the film (500) to move along an axial direction thereof such that the insert (300) moves out of the incision (510) to a next position to be cut on the film (500). The stress release method and device according to the embodiments of the present disclosure can realize the release of the stress and shrinkage of the packaging film without changing the amount of the material of the packaging film, such that the risk of wrinkling during subsequent processing can be reduced.