MIXED ABRASIVE POLISHING COMPOSITIONS

The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are ceria particles,...

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Bibliographische Detailangaben
Hauptverfasser: NALASKOWSKI, Jakub, DYSARD, Jeffrey, LAM, Viet, REISS, Brian, JIA, Renhe
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate with the chemical-mechanical polishing compositions. The polishing compositions comprise first abrasive particles, wherein the first abrasive particles are ceria particles, second abrasive particles, wherein the second abrasive particles are ceria particles, surface-modified silica particles, or organic particles, a pH-adjusting agent, and an aqueous carrier. The polishing compositions also exhibit multimodal particle size distributions.