METHOD AND DEVICE FOR CUTTING SAPPHIRE

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO 2 laser beam the coating via a CO 2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and deb...

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Bibliographische Detailangaben
Hauptverfasser: TANG, Jiangang, PENG, Yuguo, MA, Guodong, DIAO, Lingtian, GAO, Yunfeng, LU, Jiangang, LIU, Xiao, ZHANG, Xiaojun, YIN, Jiangang, YUAN, Xuerui
Format: Patent
Sprache:eng ; fre ; ger
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