METHOD AND DEVICE FOR CUTTING SAPPHIRE

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO 2 laser beam the coating via a CO 2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and deb...

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Bibliographische Detailangaben
Hauptverfasser:	TANG, Jiangang, PENG, Yuguo, MA, Guodong, DIAO, Lingtian, GAO, Yunfeng, LU, Jiangang, LIU, Xiao, ZHANG, Xiaojun, YIN, Jiangang, YUAN, Xuerui
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO 2 laser beam the coating via a CO 2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO 2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO 2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.