COMPONENT CARRIER HAVING A THREE DIMENSIONALLY PRINTED WIRING STRUCTURE

A component carrier and a method for manufacturing a component carrier is described wherein the component carrier comprises a carrier body which comprises a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the l...

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Bibliographische Detailangaben
Hauptverfasser:	Leitgeb, Markus, Lutschounig, Ferdinand, Gavagnin, Marco, Silvano de Sousa, Jonathan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A component carrier and a method for manufacturing a component carrier is described wherein the component carrier comprises a carrier body which comprises a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures wherein the wiring structure being at least partially formed as a three-dimensionally printed structure.