CAMERA MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

The present application provides a molded photosensitive module of a camera module, comprising: at least one photosensitive element; at least one circuit board; at least one set of wires, wherein two ends of each of said at least one set of wires are respectively connected to a chip connector of sai...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUO, Nan, WANG, Mingzhu, CHEN, Zhenyu, JIANG, Heng, ZHAO, Bojie, TANAKA, Takehiko, HUANG, Zhen, LUAN, Zhongyu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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