CAMERA MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

The present application provides a molded photosensitive module of a camera module, comprising: at least one photosensitive element; at least one circuit board; at least one set of wires, wherein two ends of each of said at least one set of wires are respectively connected to a chip connector of sai...

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Bibliographische Detailangaben
Hauptverfasser:	GUO, Nan, WANG, Mingzhu, CHEN, Zhenyu, JIANG, Heng, ZHAO, Bojie, TANAKA, Takehiko, HUANG, Zhen, LUAN, Zhongyu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present application provides a molded photosensitive module of a camera module, comprising: at least one photosensitive element; at least one circuit board; at least one set of wires, wherein two ends of each of said at least one set of wires are respectively connected to a chip connector of said at least one photosensitive element and a circuit connector of said at least one circuit board; at least one supporting member which is configured to cover at least a part of each of said at least one set of wires; and at least one molded base which comprises a molded body and has at least one light window, wherein a periphery area of said at least one circuit board and at least a part of said supporting member are covered by said molded body after molded, wherein said photosensitive area of said at least one photosensitive element is positioned corresponding to said light window of said at least one molded base.