CAMERA MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

CAMERA MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

The present application provides a molded photosensitive module of a camera module, comprising: at least one photosensitive element; at least one circuit board; at least one set of wires, wherein two ends of each of said at least one set of wires are respectively connected to a chip connector of sai...

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Hauptverfasser: GUO, Nan, WANG, Mingzhu, CHEN, Zhenyu, JIANG, Heng, ZHAO, Bojie, TANAKA, Takehiko, HUANG, Zhen, LUAN, Zhongyu
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
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creator GUO, Nan
WANG, Mingzhu
CHEN, Zhenyu
JIANG, Heng
ZHAO, Bojie
TANAKA, Takehiko
HUANG, Zhen
LUAN, Zhongyu
description The present application provides a molded photosensitive module of a camera module, comprising: at least one photosensitive element; at least one circuit board; at least one set of wires, wherein two ends of each of said at least one set of wires are respectively connected to a chip connector of said at least one photosensitive element and a circuit connector of said at least one circuit board; at least one supporting member which is configured to cover at least a part of each of said at least one set of wires; and at least one molded base which comprises a molded body and has at least one light window, wherein a periphery area of said at least one circuit board and at least a part of said supporting member are covered by said molded body after molded, wherein said photosensitive area of said at least one photosensitive element is positioned corresponding to said light window of said at least one molded base.
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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
title CAMERA MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
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