ELECTROPLATING MOULD AND METHOD FOR MANUFACTURING SAME

A process for manufacturing a mould including: a) providing a first substrate made of photosensitive glass of thickness of at least equal to the height of the mould, b) illuminating the first substrate with UV rays through a mask the windows of which correspond to the depression of the mould in orde...

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Bibliographische Detailangaben
Hauptverfasser:	Chabloz, Martial, Cusin, Pierre, Gandelhman, Alex, Verardo, Marco
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR APPARATUS THEREFOR CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CINEMATOGRAPHY ELECTROFORMING ELECTROGRAPHY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GLASS HOLOGRAPHY JOINING GLASS TO GLASS OR OTHER MATERIALS MATERIALS THEREFOR METALLURGY MINERAL OR SLAG WOOL ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	A process for manufacturing a mould including: a) providing a first substrate made of photosensitive glass of thickness of at least equal to the height of the mould, b) illuminating the first substrate with UV rays through a mask the windows of which correspond to the depression of the mould in order to create illuminated zones, c) carrying out a heat treatment on the first substrate obtained in step b) in order to crystallize the illuminated zones, d) providing a second substrate having at least one conductive layer on its surface, e) joining the first substrate obtained in step c) with the second substrate so that the conductive layer is located between the first substrate and the second substrate, f) removing the illuminated and crystallized zones of the first substrate so as to uncover the conductive layer, forming a cavity with sidewalls and a bottom occupied by the conductive layer of the mould.