A LAB-ON-A-CHIP FABRICATION METHOD AND SYSTEM

A LAB-ON-A-CHIP FABRICATION METHOD AND SYSTEM

A lab-on-a-chip system, and a method for fabrication of a lab-on-a-chip system. The system comprises a chip having a fluid port and being overmoulded by a moulding material in at least an area surrounding the fluid port, and having moulding material extending away from the chip, said moulding materi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MIELNIK, Michal Marek
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:A lab-on-a-chip system, and a method for fabrication of a lab-on-a-chip system. The system comprises a chip having a fluid port and being overmoulded by a moulding material in at least an area surrounding the fluid port, and having moulding material extending away from the chip, said moulding material extending away from the chip having in a first surface overlying at least part of the chip a fluid channel in communication with the fluid port of the chip, and the chip has one or more of: - a ledge or ledges along the sides thereof, and the ledge or ledges being overmoulded by said moulding material for securing the chip, and - an area of the chip surrounding the fluid port comprises one or more of trenches, roughened surface, and treated surface, for enhancing adherence of moulding material on that area to the chip.