FLEXIBLE SUBSTRATE CHIP-ON FLEX REPAIR

A digital radiographic detector includes redundant bonding pads formed on the array substrate and electrically connected to the array of photosensors. A plurality of COFs are each electrically connected to one of the bonding pads. A repair may be performed by removing a bond pad and reconnecting a c...

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Bibliographische Detailangaben
Hauptverfasser:	TREDWELL, Timothy J, WOJCIK, Timothy J, MRUTHYUNJAYA, Ravi K, HEILER, Gregory N
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MEASUREMENT OF NUCLEAR OR X-RADIATION MEASURING PHYSICS TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A digital radiographic detector includes redundant bonding pads formed on the array substrate and electrically connected to the array of photosensors. A plurality of COFs are each electrically connected to one of the bonding pads. A repair may be performed by removing a bond pad and reconnecting a corresponding COF to a redundant bond pad. A PCB including array read out electronics is electrically connected to the plurality of COFs.