LOW TEMPERATURE CO-FIREABLE DIELECTRIC MATERIALS

Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable...

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Bibliographische Detailangaben
Hauptverfasser: JIANG, Jianzhong, CRUICKSHANK, David Bowie, FIROR, David Martin, HILL, Michael David, SHUNKWILER, Jeffrey Alan, COATS, Neil Bruce
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.