LIGHT EMITTER DEVICES AND COMPONENTS WITH IMPROVED CHEMICAL RESISTANCE AND RELATED METHODS

Disclosed are LEDs and LED packages, and methods of making them, having improved resistance to infiltration by chemical entities comprising providing a coating on at least a portion of the LED chip oran LED chip package formed by co-polymerization of: (a) one or more hydrofluoroolefin monomer(s) sel...

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Bibliographische Detailangaben
Hauptverfasser:	ZHANG, Siyuan, LIU, Ya Qun, DUAN, Linlin, JIANG, Wanchao, DING, Zhe, XU, Gang
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Disclosed are LEDs and LED packages, and methods of making them, having improved resistance to infiltration by chemical entities comprising providing a coating on at least a portion of the LED chip oran LED chip package formed by co-polymerization of: (a) one or more hydrofluoroolefin monomer(s) selected from the group consisting of tetrafluoroethylene, hydrofluoroethylenes, hydrofluoropropenes,hydrofluorobutenes, hydrofluoropentenes and combinations of these; (b) optionally one or more chlorofluoroethylene monomers; (c) optionally one or more vinyl ester monomer(s); and (d) optionally one or more vinyl ether monomer(s), wherein at least a portion of said vinyl ether monomer is preferably a hydroxyl group-containing vinyl ether monomer and preferably at least one of (b) and (d) is present.