SEMICONDUCTOR PACKAGE STRUCTURE

A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate, a lower surface and a plurality of first solder receiving portions, the fi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAN, Han-Chang, LIANG, Chun-Chih, LO, Wen-Chueh, YANG, Hao-Yu, KANG, Chieh-Yu, HO, Chih-Ming, LU, Kuang-Mao, CHERNG, Ding-Hwa
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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