SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate, a lower surface and a plurality of first solder receiving portions, the fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PAN, Han-Chang, LIANG, Chun-Chih, LO, Wen-Chueh, YANG, Hao-Yu, KANG, Chieh-Yu, HO, Chih-Ming, LU, Kuang-Mao, CHERNG, Ding-Hwa
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate, a lower surface and a plurality of first solder receiving portions, the first solder receiving portions being disposed on the lower surface, wherein the first substrate being disposed on the second front surface, and the first substrate being electrically connected with the second substrate. Therefore, the shift of the solder on the printed circuit board can be prevented so that a plurality of semiconductor package structures can be arranged on the printed circuit board more densely.