TERMINATION RING WITH GAPPED METALLIC LAYER

In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the n...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FULLER, Anthony M, SCHULTE, Donald W, MCMAHON, Terry
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.