ADHESIVE FILM FOR USE IN SEMICONDUCTOR DEVICE MANUFACTURING, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

An adhesive film (50) for manufacturing a semiconductor device according to the present invention is used for temporarily fixing an electronic component (70) when encapsulating the electronic component (70) with an encapsulating material (60) in a manufacturing process of a semiconductor device. The...

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Bibliographische Detailangaben
Hauptverfasser:	MORIMOTO, Akimitsu, IGARASHI, Kouji, FUKUMOTO, Hideki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive film (50) for manufacturing a semiconductor device according to the present invention is used for temporarily fixing an electronic component (70) when encapsulating the electronic component (70) with an encapsulating material (60) in a manufacturing process of a semiconductor device. The film (50) includes a base material layer (10), and an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and for temporarily fixing the electronic component (70). Surface free energy of a surface of the adhesive resin layer (A) is equal to or less than 38.0 mN/m.