HYBRID MICROELECTRONIC SUBSTRATES

HYBRID MICROELECTRONIC SUBSTRATES

Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the reces...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SANKMAN, Robert L, ALUR, Amruthavalli Pallavi, STARKSTON, Robert, MOKLER, Scott M, STAMEY, Richard Christopher
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.