COOLING DEVICE

A cooling device 10 may be configured to cool a shape-memory alloy member. The cooling device 10 may include: a cooling unit 20 configured to cool the shape-memory alloy member or a part that is to make contact with the shape-memory alloy member; a refrigerant supply pipe 30, 31 including one end co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IKEDA Tetsuo, YOSHIMI Yukiharu, KAWAI Hirohisa
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A cooling device 10 may be configured to cool a shape-memory alloy member. The cooling device 10 may include: a cooling unit 20 configured to cool the shape-memory alloy member or a part that is to make contact with the shape-memory alloy member; a refrigerant supply pipe 30, 31 including one end connected to a refrigerant supply source 34 and other end connected to the cooling unit 20, the refrigerant supply pipe 30, 31 configured to supply a refrigerant supplied from the refrigerant supply source 34 to the cooling unit 20; and a refrigerant discharge pipe 32, 33 including one end connected to the cooling unit 20, the refrigerant discharge pipe 32, 33 configured to discharge the refrigerant discharged from the cooling unit 20 from other end of the refrigerant discharge pipe 32, 33.