REACTIVE HOT MELT ADHESIVE COMPOSITION

The present invention relates to a process for preparing a reactive hotmelt adhesive formulation having a low residual content of monomeric diisocyanate. The present invention further provides a reactive hotmelt adhesive composition obtainable by the process of the invention.

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Bibliographische Detailangaben
Hauptverfasser:	LINEMANN, Annett, BENNOUR, Haythem
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a process for preparing a reactive hotmelt adhesive formulation having a low residual content of monomeric diisocyanate. The present invention further provides a reactive hotmelt adhesive composition obtainable by the process of the invention.