Cu-BASED SINTERED SLIDING MATERIAL, AND PRODUCTION METHOD THEREFOR

The Cu-based sintered sliding material of the present invention has a composition including, by mass%, 7% to 35% of Ni, 1% to 10% of Sn, 0.9% to 3% of P, and 0.5% to 5% of C, with a remainder of Cu and inevitable impurities, wherein the Cu-based sintered sliding material includes a sintered body inc...

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Bibliographische Detailangaben
1. Verfasser:	ISHII Yoshinari
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS BEARINGS BLASTING CASTING CHEMISTRY ELEMENTS OR CRANKSHAFT MECHANISMS ENGINEERING ELEMENTS AND UNITS FERROUS OR NON-FERROUS ALLOYS FLEXIBLE SHAFTS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MECHANICAL ENGINEERING METALLURGY PERFORMING OPERATIONS POWDER METALLURGY ROTARY BODIES OTHER THAN GEARING ELEMENTS SHAFTS THERMAL INSULATION IN GENERAL TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WEAPONS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The Cu-based sintered sliding material of the present invention has a composition including, by mass%, 7% to 35% of Ni, 1% to 10% of Sn, 0.9% to 3% of P, and 0.5% to 5% of C, with a remainder of Cu and inevitable impurities, wherein the Cu-based sintered sliding material includes a sintered body including: alloy grains that contain Sn and C and contain a Cu-Ni-based alloy as a main component; grain boundary phases that contain Ni and P as main components and are dispersedly distributed in grain boundaries of the alloy grains; and free graphite that intervenes at the grain boundaries of the alloy grains, the Cu-based sintered sliding material has a structure in which pores are dispersedly formed in the grain boundaries of the alloy grains, and an amount of C in a metal matrix including the alloy grains and the grain boundary phases is, by mass%, 0.02% to 0.20%.