CSP LED MODULE HAVING IMPROVED LIGHT EMISSION

The invention relates to an LED module (10) having a carrier (1) and at least two LED components (2) arranged on a surface (1a) of the carrier, wherein the LED components (2) are each LED chips (2a) individually surrounded by a casting compound (2b), wherein the LED components (2) are arranged with...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RIEMER, Steffen, DOBOS, Janos, SZÜCS, Anna, GRUENDLING, Vladimir
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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