CSP LED MODULE HAVING IMPROVED LIGHT EMISSION

CSP LED MODULE HAVING IMPROVED LIGHT EMISSION

The invention relates to an LED module (10) having a carrier (1) and at least two LED components (2) arranged on a surface (1a) of the carrier, wherein the LED components (2) are each LED chips (2a) individually surrounded by a casting compound (2b), wherein the LED components (2) are arranged with...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: RIEMER, Steffen, DOBOS, Janos, SZÜCS, Anna, GRUENDLING, Vladimir
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to an LED module (10) having a carrier (1) and at least two LED components (2) arranged on a surface (1a) of the carrier, wherein the LED components (2) are each LED chips (2a) individually surrounded by a casting compound (2b), wherein the LED components (2) are arranged with the formation of an intermediate space (4) between two opposing side surfaces (2d) of the LED components (2), and a transparent cover (3) arranged over the LED components (2), which covers the at least two LED components (2) and at least partially fills the intermediate space (4) between the LED components (2), and wherein the cover (3) consists of a material having a substantially equal refractive index or index of refraction to the individual casting compound (2b) of the LED chips (2a), and wherein the carrier is a circuit board and the LED components (2) are chip-scale package (CSP) LEDs.