METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE

A method comprises placing a semiconductor substrate on a first curved surface of a first bending tool, using a second bending tool with a second surface to apply pressure to the semiconductor substrate, thereby pressing the semiconductor substrate onto the first curved surface and bending the semic...

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Hauptverfasser: Wedi, Andre, Stahlhut, Christian, Oeschler, Niels, Boenig, Guido
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Wedi, Andre
Stahlhut, Christian
Oeschler, Niels
Boenig, Guido
description A method comprises placing a semiconductor substrate on a first curved surface of a first bending tool, using a second bending tool with a second surface to apply pressure to the semiconductor substrate, thereby pressing the semiconductor substrate onto the first curved surface and bending the semiconductor substrate, and removing the bended semiconductor substrate from the first bending tool.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
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