CONDUCTIVE CONNECTORS HAVING A RUTHENIUM/ALUMINUM-CONTAINING LINER AND METHODS OF FABRICATING THE SAME

A conductive connector for a microelectronic structure may be formed in an opening in a dielectric layer, wherein a ruthenium/aluminum-containing liner is disposed between the dielectric layer and a substantially aluminum-free copper fill material within the opening. The ruthenium/aluminum-containin...

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Bibliographische Detailangaben

Hauptverfasser:	CLARKE, James S, JEZEWSKI, Christopher J, KOBRINSKY, Mauro J, CHEBIAM, Ramanan V, CHAWLA, Jasmeet S
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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