VISCOUS FLUID SUPPLY DEVICE

In a flux unit (30) of the present invention, a flux supply device (126) configured to eject flux to a storage tray (122) has an ejection port (156) configured to eject the flux, and an ejection port moving device (148) configured to move the ejection port (156) in the radial direction of the storag...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MURASE, Tadashi, FUKAYA, Yoshiyuki, MATSUYAMA, Kazuya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	In a flux unit (30) of the present invention, a flux supply device (126) configured to eject flux to a storage tray (122) has an ejection port (156) configured to eject the flux, and an ejection port moving device (148) configured to move the ejection port (156) in the radial direction of the storage tray (122). By this, the flux is ejected in a wide range in the radial direction of the storage tray (122). Also, the storage tray (122) is rotated by a tray rotation device (120). Thus, the film thickness of the flux ejected in the wide range of the storage tray is adjusted by a squeegee all at once. Thus, the time required for adjusting the film thickness of the flux can be reduced.