THERMAL TREATMENT FOR PRECONDITIONING OR RESTORATION OF A SOLDER JOINT

A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint assembly. The method comprising heating the solder in the assembly to a temperature near the solvus.

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Bibliographische Detailangaben
Hauptverfasser:	ROMANSKY, Marianne, MESCHTER, Stephan, PEROVIC, Doug D, ADAMS, David, KOSIBA, Eva, KENNEDY, Jeffrey K, SNUGOVSKY, Leonid, SNUGOVSKY, Polina, ROBINSON, Michael O, JUAREZ, Joseph, STRAZNICKY, Ivan, HILLMAN, David
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint assembly. The method comprising heating the solder in the assembly to a temperature near the solvus.