PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE INCLUDING CURED PRODUCT OF PATTERN-FORMING COMPOSITION INCLUDING THE PHOTOSENSITIVE RESIN COMPOSITION

PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE INCLUDING CURED PRODUCT OF PATTERN-FORMING COMPOSITION INCLUDING THE PHOTOSENSITIVE RESIN COMPOSITION

A photosensitive resin composition is provided. The photosensitive resin composition includes a first binder resin and a second binder resin that have a weight average molecular weight of about 7,000 g/mol to about 12,000 g/mol, and an electronic apparatus including a cured product of a pattern-form...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM, Sujeong, SONG, Inseok, LEE, Yuiku
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A photosensitive resin composition is provided. The photosensitive resin composition includes a first binder resin and a second binder resin that have a weight average molecular weight of about 7,000 g/mol to about 12,000 g/mol, and an electronic apparatus including a cured product of a pattern-forming composition including the photosensitive resin composition.