METHOD OF LASER PROCESSING FOR DRILLING A HOLE IN A GLAS SUBSTRATE WITH WET ETCHING PROCESS

Provided is a laser processing method for drilling a hole (4) in a glass substrate (1) with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate (1) from a side of the glass substrate (1) on which a protective sheet is adhered so...

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Bibliographische Detailangaben
Hauptverfasser:	ITO, Yasushi, TATEISHI, Kaori
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a laser processing method for drilling a hole (4) in a glass substrate (1) with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate (1) from a side of the glass substrate (1) on which a protective sheet is adhered so as to form a blind hole (4) ; removing the protective sheet from the glass substrate (1) and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate (1) not irradiated with the laser so as to convert the blind hole (4) into a through hole (4).