METHOD FOR MANUFACTURING SURFACE-MODIFIED THERMOPLASTIC RESIN, METHOD FOR MANUFACTURING BONDED STRUCTURE, BONDED STRUCTURE, THERMAL TRANSFER SURFACE-MODIFIED SHEET, THERMOPLASTIC RESIN WITH THERMAL TRANSFER SURFACE-MODIFIED SHEET, AND SURFACE-MODIFIED THERMOPLASTIC RESIN

A method for manufacturing a surface-modified thermoplastic resin in which sufficient bonding strength is applied to a thermoplastic resin is provided. A method for manufacturing a bonded structure capable of exhibiting sufficient bonding strength, in which the surface-modified thermoplastic resin o...

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Bibliographische Detailangaben
Hauptverfasser: TANAKA Akiko, SHIMAZU Akira, SHIMOKITA Keisuke, FUNATSU Eriko, GOMI Asuka, OKADA Kenichi
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A method for manufacturing a surface-modified thermoplastic resin in which sufficient bonding strength is applied to a thermoplastic resin is provided. A method for manufacturing a bonded structure capable of exhibiting sufficient bonding strength, in which the surface-modified thermoplastic resin obtained by the manufacturing method described above is laminated on an adherend with an adhesive layer interposed therebetween, is provided. A bonded structure capable of exhibiting sufficient bonding strength is provided. A thermal transfer surface-modifying sheet that can be preferably used in the method for manufacturing a surface-modified thermoplastic resin is provided. A thermoplastic resin with a thermal transfer surface-modifying sheet including the thermal transfer surface-modifying sheet is provided. A surface-modified thermoplastic resin in which sufficient bonding strength is applied to a thermoplastic resin is provided. The method for manufacturing a surface-modified thermoplastic resin of the invention, in which an easy adherence layer is laminated on a thermoplastic resin having a melting point of T°C, the method includes: providing the easy adherence layer on at least a part of a surface of the thermoplastic resin; and performing heat welding at a temperature equal to or higher than (T - 50)°C.