THREE-DIMENSIONAL FORMING METHOD FOR RESIN PACKAGING MATERIAL AND RESIN PACKAGING MATERIAL

The present invention relates to a method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than...

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Bibliographische Detailangaben
Hauptverfasser: YAMAGUCHI, Madoka, YASUUMI, Takahiro, HATANO, Yasushi, KURIYAMA, Kouji
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention relates to a method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a large protrusion. Even in this case, the present invention reduces the shaping load to relieve the burden on equipment, provides excellent productivity, and furthermore, decreases the residual stress at the three-dimensionally shaped portion after the shaping, such that a decrease in the shaping height of the three-dimensionally shaped portion is prevented or controlled even after hot filling with contents.