PHOTONIC INTEGRATED CIRCUIT PACKAGE

Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode;...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHANG, Jiaming, OSENBACH, John W, OLMEDO, Miguel Iglesias, KISH, Fred A, EVANS, Peter W, ANAGNOSTI, Maria
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.