PHOTONIC INTEGRATED CIRCUIT PACKAGE
Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode;...
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Hauptverfasser: | , , , , , |
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Online-Zugang: | Volltext bestellen |
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Zusammenfassung: | Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip. |
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