MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBSTRATE

Embodiments of the invention include a microelectronic device comprising a package substrate; an antenna within the package substrate, wherein the antenna is configured to transmit or receive wireless communications with a frequency of at least 24 gigahertz; and a die physically coupled with the pac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAMGAING, Telesphor, DOGIAMIS, Georgios, C, NAIR, Vijay, K
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Embodiments of the invention include a microelectronic device comprising a package substrate; an antenna within the package substrate, wherein the antenna is configured to transmit or receive wireless communications with a frequency of at least 24 gigahertz; and a die physically coupled with the package substrate within the microelectronic device, wherein the die includes circuitry related to transmission or reception of a wireless communication.