MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBSTRATE
Embodiments of the invention include a microelectronic device comprising a package substrate; an antenna within the package substrate, wherein the antenna is configured to transmit or receive wireless communications with a frequency of at least 24 gigahertz; and a die physically coupled with the pac...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Embodiments of the invention include a microelectronic device comprising a package substrate; an antenna within the package substrate, wherein the antenna is configured to transmit or receive wireless communications with a frequency of at least 24 gigahertz; and a die physically coupled with the package substrate within the microelectronic device, wherein the die includes circuitry related to transmission or reception of a wireless communication. |
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