HOLD-TIME COMPENSATION USING FREE METAL SEGMENTS
Methods and apparatuses pertaining to hold-time compensation using free metal segments or other electrically-conductive segments of an IC are described. An integrated circuit, IC, having free segment hold-time compensation may include a monolithic semiconductor substrate which has a first device (11...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | Methods and apparatuses pertaining to hold-time compensation using free metal segments or other electrically-conductive segments of an IC are described. An integrated circuit, IC, having free segment hold-time compensation may include a monolithic semiconductor substrate which has a first device (11) and a second device (12) disposed thereon. In addition, the IC may include an electrical node electrically connecting the first and second devices. The electrical node may include one or more electrically-conductive elements (43) that contribute to a total capacitance at the electrical node such that the total capacitance at the electrical node has a value that fulfills a hold-time requirement at the electrical node. |
|---|