ELECTRICAL COMPONENT WITH THIN SOLDER RESIST LAYER AND METHOD FOR THE PRODUCTION THEREOF

An electrical device and a method for the manufacture of an electrical device are specified. The device has a carrier with an upper side and a metallized contact surface arranged on it as well as a solder mask layer which covers a part of the upper side but not the contact surface. The solder mask l...

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Bibliographische Detailangaben
1. Verfasser:	SCHMAJEW, Alexander
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	An electrical device and a method for the manufacture of an electrical device are specified. The device has a carrier with an upper side and a metallized contact surface arranged on it as well as a solder mask layer which covers a part of the upper side but not the contact surface. The solder mask layer has a thickness of 200 nm or less, thereby facilitating subsequent process steps for encapsulating the device.