ELECTRONIC ASSEMBLY WITH PHASE-CHANGE COOLING OF A SEMICONDUCTOR DEVICE

An electronic assembly (111) comprises a heat-conducting feature (21) that has a first side (22) and a second side (24) opposite the first side. An evaporator stack (26) has a floor (28) and a hollow body (42). The evaporator stack overlies the heat-conducting feature. The heated floor can convert a...

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Bibliographische Detailangaben
Hauptverfasser:	SINGH, Brij N, ROAN, Thomas J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic assembly (111) comprises a heat-conducting feature (21) that has a first side (22) and a second side (24) opposite the first side. An evaporator stack (26) has a floor (28) and a hollow body (42). The evaporator stack overlies the heat-conducting feature. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container (36) is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.