PARTICLES, PARTICLE MATERIAL, CONNECTING MATERIAL, AND CONNECTION STRUCTURE

A particle that can suppress the occurrence of cracks during a stress load, and further can improve the moisture resistance is provided. The particle according to the present invention is a particle having a 10% K value of 100 N/mm 2 or less, and the particle having a 10% K value of 100 N/mm 2 or le...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	UEDA, Saori, YAMADA, Yasuyuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON CURRENT COLLECTORS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRICITY FREQUENCY-CHANGING GENERAL PROCESSES OF COMPOUNDING LINE CONNECTORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	A particle that can suppress the occurrence of cracks during a stress load, and further can improve the moisture resistance is provided. The particle according to the present invention is a particle having a 10% K value of 100 N/mm 2 or less, and the particle having a 10% K value of 100 N/mm 2 or less contains a silicone particle body, and multiple organic resin particles deposited on a surface of the silicone particle body.