HYBRID COMPONENT CARRIER AND METHOD FOR MANUFACTURING THE SAME

Method for manufacturing of a hybrid component carrier 100 comprising: providing a first layer structure 110 having at least one electrically insulating layer and at least one electrically conductive layer; and forming of a second layer structure 160 on the first layer structure 110 wherein the seco...

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Bibliographische Detailangaben
Hauptverfasser: Leitgeb, Markus, Moitzi, Heinz
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Method for manufacturing of a hybrid component carrier 100 comprising: providing a first layer structure 110 having at least one electrically insulating layer and at least one electrically conductive layer; and forming of a second layer structure 160 on the first layer structure 110 wherein the second layer structure 160 comprises at least a first layer and a second layer, wherein the first layer structure 110 has a first density of electrically conductive elements and wherein the second layer structure 160 has a second density of electrically conductive elements, wherein the second density of electrically conductive elements is larger than the first density of electrically conductive elements, and wherein the forming of the second layer structure 160 on the first layer structure 110 comprises: forming the first layer 162 of the second layer structure 160 on the first layer structure 110; and subsequently forming the second layer 164 of the second layer structure 160 on the first layer 162 of the second layer structure 160.