SEALED PACKAGE INCLUDING ELECTRONIC DEVICE AND POWER SOURCE

Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device dispose...

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Bibliographische Detailangaben
Hauptverfasser: PETERSON, Kris A, RIES, Andrew J, WIKLUND, Craig L, NIDELKOFF, Michael J, DAY, John K, RUBEN, David A
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.