HIGH-STRENGTH TRANSPARENT POLYAMIDIMIDE AND METHOD FOR PREPARING SAME

The present invention provides a polyamide-imide film which maintains transparency and has highly enhanced mechanical properties and heat resistance. The polyamide-imide shows excellent transparency, heat resistance, mechanical strength and flexibility and thus can be used in various fields such as...

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Bibliographische Detailangaben
Hauptverfasser:	SUH, Jun Sik, KIM, Kyungjun, YUN, Cheolmin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a polyamide-imide film which maintains transparency and has highly enhanced mechanical properties and heat resistance. The polyamide-imide shows excellent transparency, heat resistance, mechanical strength and flexibility and thus can be used in various fields such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPC), tapes, touch panels and protective films for optical disks.