MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR

A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the hor...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CALTABIANO, Daniele, ROSELLI, Giuditta, PICCO, Andrea, BRAGHIN, Francesco, POMARICO, Anna Angela, ABBASI GAVARTI, Mohammad
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS TESTING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	CALTABIANO, Daniele ROSELLI, Giuditta PICCO, Andrea BRAGHIN, Francesco POMARICO, Anna Angela ABBASI GAVARTI, Mohammad
description	A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3364166A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3364166A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3364166A13</originalsourceid><addsrcrecordid>eNqNikEKwjAUBbNxIeod_gWKlEj2aXilwTQJ-amgm1IkrkQL9f7YhQdwMwPDbIXvrUkBDian0MN02lujHfEK3ThQM7hzla8RFC1uIYEtZ3sBtSEZHOMaeEgghueQ9mLzmJ5LOfy8E9Qim64q83ssyzzdy6t8RkQp1alWStfyj-ULDl8uzg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR</title><source>esp@cenet</source><creator>CALTABIANO, Daniele ; ROSELLI, Giuditta ; PICCO, Andrea ; BRAGHIN, Francesco ; POMARICO, Anna Angela ; ABBASI GAVARTI, Mohammad</creator><creatorcontrib>CALTABIANO, Daniele ; ROSELLI, Giuditta ; PICCO, Andrea ; BRAGHIN, Francesco ; POMARICO, Anna Angela ; ABBASI GAVARTI, Mohammad</creatorcontrib><description>A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.</description><language>eng ; fre ; ger</language><subject>MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; TESTING ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180822&DB=EPODOC&CC=EP&NR=3364166A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180822&DB=EPODOC&CC=EP&NR=3364166A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CALTABIANO, Daniele</creatorcontrib><creatorcontrib>ROSELLI, Giuditta</creatorcontrib><creatorcontrib>PICCO, Andrea</creatorcontrib><creatorcontrib>BRAGHIN, Francesco</creatorcontrib><creatorcontrib>POMARICO, Anna Angela</creatorcontrib><creatorcontrib>ABBASI GAVARTI, Mohammad</creatorcontrib><title>MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR</title><description>A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.</description><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAUBbNxIeod_gWKlEj2aXilwTQJ-amgm1IkrkQL9f7YhQdwMwPDbIXvrUkBDian0MN02lujHfEK3ThQM7hzla8RFC1uIYEtZ3sBtSEZHOMaeEgghueQ9mLzmJ5LOfy8E9Qim64q83ssyzzdy6t8RkQp1alWStfyj-ULDl8uzg</recordid><startdate>20180822</startdate><enddate>20180822</enddate><creator>CALTABIANO, Daniele</creator><creator>ROSELLI, Giuditta</creator><creator>PICCO, Andrea</creator><creator>BRAGHIN, Francesco</creator><creator>POMARICO, Anna Angela</creator><creator>ABBASI GAVARTI, Mohammad</creator><scope>EVB</scope></search><sort><creationdate>20180822</creationdate><title>MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR</title><author>CALTABIANO, Daniele ; ROSELLI, Giuditta ; PICCO, Andrea ; BRAGHIN, Francesco ; POMARICO, Anna Angela ; ABBASI GAVARTI, Mohammad</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3364166A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CALTABIANO, Daniele</creatorcontrib><creatorcontrib>ROSELLI, Giuditta</creatorcontrib><creatorcontrib>PICCO, Andrea</creatorcontrib><creatorcontrib>BRAGHIN, Francesco</creatorcontrib><creatorcontrib>POMARICO, Anna Angela</creatorcontrib><creatorcontrib>ABBASI GAVARTI, Mohammad</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CALTABIANO, Daniele</au><au>ROSELLI, Giuditta</au><au>PICCO, Andrea</au><au>BRAGHIN, Francesco</au><au>POMARICO, Anna Angela</au><au>ABBASI GAVARTI, Mohammad</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR</title><date>2018-08-22</date><risdate>2018</risdate><abstract>A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP3364166A1
source	esp@cenet
subjects	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS TESTING TRANSPORTING
title	MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T08%3A13%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CALTABIANO,%20Daniele&rft.date=2018-08-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3364166A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true