MICROELECTROMECHANICAL SCALABLE BULK-TYPE PIEZORESISTIVE FORCE/PRESSURE SENSOR

A microelectromechanical force/pressure sensor (1) has: a sensor die (2), of semiconductor material, having a front surface (2a) and a bottom surface (2b), extending in a horizontal plane (xy), and made of a compact bulk region having a thickness along a vertical direction (z), transverse to the horizontal plane (xy); piezoresistive elements (6), integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die (8), coupled above the sensor die, covering the piezoresistive elements, having a respective front surface (8a) and bottom surface (8b), opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer (4) is arranged between the front surface (2a) of the sensor die (2) and the bottom surface (8b) of the cap die (8), patterned to define a groove (5) traversing its entire thickness along the vertical direction; the piezoresistive elements (6) are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied from the front surface of the cap die and/or bottom surface of the sensor die into a planar stress distribution at the groove, acting in the horizontal plane.