ELECTRICALLY INSULATING THERMALLY CONDUCTIVE POLYMER RESIN COMPOSITION BASED ON STYRENICS WITH BALANCED PROPERTIES

Thermally conductive polymer (TCP) resin composition (i) or (ii) are described, comprising components (I) and (II): (i) 40 to 72% by volume of at least one matrix polymer (I); 28 to 60% by volume of a thermally conductive filler material (II) (D50 0.1 to 200 μm) consisting of aluminosilicate (II-1)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NIESSNER, Norbert, MICHAELIS DE VASCONCELLOS, Janna, SCHMIDT, Hans-Werner, MICHELS, Gisbert, KOLB, Tristan, WIEBERGER, Florian, SCHULZ, Tobias
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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